Samsung Electro-Mechanics has signed a memorandum of understanding (MOU) with the Sumitomo Chemical Group to establish a joint venture dedicated to producing Glass Core, a key material for next-generation semiconductor package substrates.
The partnership aims to overcome current technological constraints in package substrates amid growing demand driven by artificial intelligence (AI) and high-performance computing (HPC). According to both companies, Glass Core provides superior dimensional stability and flatness compared to conventional organic substrates, making it ideal for high-density, large-area semiconductor packaging.
Under the agreement, Samsung Electro-Mechanics will serve as the majority shareholder, while Sumitomo Chemical will hold a minority stake. Specific details—including ownership structure, corporate name, and business timeline—will be finalized next year. The joint venture will be headquartered at Dongwoo Fine-Chem’s Pyeongtaek site in South Korea, which will also house the initial production facilities.
Currently, Samsung Electro-Mechanics is developing glass package substrate prototypes at its Sejong pilot line, with mass production scheduled to commence through the new joint venture after 2027.
Source: samsungsem.com/global/newsroom