Siemens and nVent are partnering to develop a liquid cooling and power reference architecture specifically designed for hyperscale AI workloads. The modular blueprint is intended to help data center operators deploy AI infrastructure more quickly, intelligently, and sustainably.
As AI workloads become more compute-intensive and geographically distributed, data center strategies must carefully balance performance, efficiency, and scalability through increasingly adaptive and intelligent systems. To address these evolving demands, Siemens and nVent are combining their expertise to help data centers prepare robust cooling and power infrastructure that supports global deployment and long-term operational resilience.
The joint reference architecture is designed to support 100 MW hyperscale AI data centers capable of housing large-scale, liquid-cooled AI platforms such as NVIDIA DGX SuperPOD with DGX GB200 systems. The Tier III-capable design integrates Siemens’ industrial-grade electrical and automation technologies with NVIDIA DGX SuperPOD reference designs and nVent’s advanced liquid cooling solutions.
Today’s data centers face rising rack-level power densities, increasingly demanding workloads, and the need for modular designs that support uptime and scalability. Reference architectures are critical in addressing these challenges by enabling faster deployment, standardizing interfaces, and providing a foundation for ongoing infrastructure innovation.
Siemens brings extensive expertise in industrial-grade electrical systems and intelligent infrastructure to the data center market. Its end-to-end portfolio—from medium- and low-voltage power distribution to advanced automation and energy management software—supports reliable, efficient, and sustainable operation of mission-critical facilities. By integrating IoT-enabled hardware, AI-driven applications, cloud-based software, and digital services, Siemens helps data center operators scale with confidence to meet the requirements of AI-driven workloads.
nVent is a recognized leader in liquid cooling, with a proven history of solving complex thermal challenges for global cloud service providers. Leveraging a broad product portfolio and deep technical expertise, nVent collaborates with leading chip manufacturers, OEMs, and hyperscalers to deliver reliable, scalable liquid cooling solutions that support the future of high-density computing.
“We have decades of experience supporting customers’ next-generation computing infrastructure,” said Sara Zawoyski, President of nVent Systems Protection. “This collaboration with Siemens reinforces that commitment and provides data center operators with a proven architecture to deploy advanced cooling infrastructure for AI growth.”
“This reference architecture shortens time-to-compute and maximizes tokens-per-watt, a key measure of AI efficiency,” said Ciaran Flanagan, Global Head of Data Center Solutions at Siemens. “It delivers a scalable, modular, fault-tolerant, and energy-efficient blueprint. Together with nVent and our broader partner ecosystem, we are enabling greater interoperability, innovation, and sustainability—helping operators build future-ready data centers that fully realize AI’s potential.”
Source: industryeurope.com